PHILADELPHIA--(BUSINESS WIRE)--Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today introduced its new IKONIC™ polishing pad platform, bringing to market Dow’s most ...

AURORA, Ill., Oct. 20, 2010 (GLOBE NEWSWIRE) -- Cabot Microelectronics Corporation (Nasdaq:CCMP), the world's leading supplier of chemical mechanical planarization (CMP) polishing slurries and growing ...

PHILADELPHIA--(BUSINESS WIRE)-- Following the introduction of its IKONIC™ chemical mechanical planarization (CMP) polishing pad platform in late 2012, Dow Electronic Materials, a business unit of The ...

Dow Electronic Materials, a unit of U.S. chemical kingpin The Dow Chemical Company ( DOW), has launched the first chemical mechanical planarization (CMP) polishing pads from its new IKONIC 2000 and ...

What Is Chemical Mechanical Polishing? Chemical mechanical polishing (CMP) or chemical mechanical planarization (CMP), is a technique used to smoothen and flatten surfaces at the nanoscale level. It ...

Aurora, IL, Jan. 24, 2011 (GLOBE NEWSWIRE) -- Cabot Microelectronics Corporation (Nasdaq:CCMP), the world's leading supplier of chemical mechanical planarization (CMP) polishing slurries and a growing ...

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SANTA CLARA, Calif.--(BUSINESS WIRE)--Applied Materials, Inc. today announced its innovative Applied DuraPad ™ CMP polishing pad technology for 200mm chemical mechanical planarization (CMP) systems.

Fujifilm is expanding its chemical-mechanical planarization (CMP) polishing agent production in Japan to meet the rising demand for AI chips in Asia. This expansion will increase production by 30% and ...

Polishing with the help of CMP slurries is an integral part of microcircuit manufacturing. The particle size distribution (PSD) measurement on the CMP slurries is required to ensure their health, ...