In the EEMG, we have developed numerous tools and techniques for the coupled multi-physics analysis of actuators, electrical machines and wound passive components. The modelling techniques employed ...
eGaN FETs and ICs enable very high-density power converter design, owing to their compact size, ultra-fast switching, and low on-resistance. The limiting factor for output power in most high-density ...
The miniaturization of electronic systems and the diffusion of components that generate a lot of heat make the role of thermal analysis more and more important as a tool to guarantee the good ...
Rogers Corporation has introduced RT/duroid(tm) 6035HTC, a new high-thermal-conductivity (HTC) laminate material engineered for low loss in high-power circuits. Rogers Corporation has introduced ...
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