The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...

A key objective of electronics engineers is to further reduce the size of devices, while also boosting their speed, performance and efficiency. Two-dimensional (2D) semiconductors, single-layer and ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Adeia Inc. (Nasdaq: ADEA), a leading research and development and intellectual property licensing company known for bringing innovations in the semiconductor and ...

OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the heterogeneous integration of ...

Hybrid bonding is gaining traction in advanced packaging because it offers the shortest vertical connection between dies of similar or different functionalities, as well as better thermal, electrical ...

Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...

Hybrid bonding is becoming more critical for advanced semiconductor packaging, thanks to its ability to enable high-density interconnects inside complex 3D assemblies. This approach involves the ...

"Driven by AI accelerators, automotive ECUs, and edge computing, the global semiconductor silicon wafer market sees rising ...

- Contributing to the advancement of photonics-electronics convergence technology and working with partners for early commercialization - TOKYO--(BUSINESS WIRE)-- OKI (TOKYO: 6703) has successfully ...