ST. PAUL, Minn.--(BUSINESS WIRE)--3M, a leading supplier of advanced materials to the semiconductor packaging industry, today announced the opening of the company’s application laboratory in Yangmei, ...

“This order from one of the largest Chinese foundries further cements EV Group's position as the market and technology leader in wafer bonding for leading-edge applications,” stated Hermann Waltl, ...

BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...

Strategic partnership kicks off with installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX) Kicking off this ...

The two companies say they are cooperating on the development of low temperature wafer bonding equipment and process technologies. Silicon Genesis Corp. (SiGen) and EV Group (EVG) said today they are ...

GARCHING, Germany--(BUSINESS WIRE)--SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, launched the XBC300 Gen2, a high volume ...

Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. It’s a confusing landscape with a plethora of buzzwords ...

New EVG ® 40 D2W overlay metrology system provides 100 percent overlay measurement on every die at up to 15X higher throughput versus industry benchmark ST. FLORIAN, Austria, Sept. 8, 2025 /PRNewswire ...

Innovative materials are critical for maintaining integrity during advanced semiconductor manufacturing processes. Temporary bonding is being enabled by these new materials and is making a name for ...