Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...

Advancing AI Chip Manufacturing With Applied Materials Today Building the chips that power artificial intelligence is getting ...

A recent technical paper titled “Factors determining bond wave speed in wafer bonding” was published by researcher at Yokohama National University, Tokyo Electron Kyushu Limited and ANVOS Analytics.

“Following a thorough evaluation of a number of wafer bonding systems, we selected EVG's solution for its superior technology capabilities. The affordable R&D system demonstrated outstanding results, ...

“Our 200-mm EVG850LT system has been instrumental in helping us fulfill customer requirements for high-performance SOI wafers,” stated Prof. He ZhiQiang, CEO of SST. “As we look to advance our ability ...

SANTA CLARA, Calif., Sept. 08, 2021 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today introduced new technologies and capabilities designed to help its customers accelerate their technology roadmaps ...